B.Tech. Computer Science and Engineering
(AI & DE) in tie up with

LPU offers B.Tech. Computer Science and Engineering (Artificial Intelligence & Data Engineering) in tie up with

Data is like raw, unrefined oil, while Data engineers are like refineries. On the other hand, the world is already embracing Artificial Intelligence as it is expected to be used in almost every domain possible. The demand for competent talent in these fields is vastly more than the availability of such candidates. This program is specifically designed to bridge this talent gap.

LPU is Ranked 3rd by Atal Ranking of Institutions on Innovation Achievements 2021.
LPU is Ranked 36th Amongst Top Universities In India as per Times Higher Education World University Rankings 2022
Faculty of Engineering is Ranked 51st amongst all Government and Private Engineering Institutions in India as per NIRF 2022 Rankings released by Ministry of Education, Govt. of India
LPU Ranks 74th among Top 100 Universities Globally as per Times Higher Education Impact Rankings 2022

Why Artificial Intelligence & Data Engineering in tie-up with Futurense Technologies?

Conditional Letter of Intent

  • Assured Package of Upto 12 LPA* at the start of degree
  • Avg. Salary of ₹ 9 LPA* with a Min. package of ₹ 6 LPA*
*Conditions apply

Global Professors of Practice

Get mentored by global professors of practice, industry thought leaders from top universities across the world!

Become future-ready professionals with Futurense

Work on real-time projects with emerging technologies and become future-proof!

Real-Time Industry Experience

With 3 paid internships throughout the course of 4 years, earn the right work experience while you learn!

Global Industry Mentorship

Mentorship through Global Professors of Practice and Industry thought Leaders.

Programme Architects

Programme Details


4 years (8 Semesters)

Programme Fee

₹ 190000 per Semester

₹62.72 LPA

Highest Salary Package Offered

₹6.35 LPA

Average Salary Package


Offers Generated from Fortune 500 Companies




Publication Count


Patent Filed


Conferences and Workshops